基于多層LCP基板的高密度系統(tǒng)集成技術(shù)
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叢書(shū)名：微電子與集成電路技術(shù)叢書(shū)
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- 作者：劉維紅 等
- 出版時(shí)間：2024/3/1
- ISBN：9787121472787
- 出 版 社：電子工業(yè)出版社
- 中圖法分類(lèi)：TN402
- 頁(yè)碼：224
- 紙張：
- 版次：01
- 開(kāi)本：16開(kāi)
本書(shū)共 5 章，第 1 章為 LCP 材料簡(jiǎn)介及制備工藝，第 2 章為多層 LCP 電路板中過(guò)孔互連結(jié)構(gòu)的研究，第 3章為毫米波射頻前端系統(tǒng)中鍵合線(xiàn)電路的分析與設(shè)計(jì)，第 4 章為微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)，第 5 章為基于 LCP 無(wú)源器件的設(shè)計(jì)與研究。本書(shū)從 LCP 電路的制備工藝講起，系統(tǒng)地闡述了雙層及多層 LCP 電路板的制備過(guò)程，以及激光開(kāi)腔工藝的實(shí)現(xiàn)方法，為電路設(shè)計(jì)工程技術(shù)人員提供了工藝參考。同時(shí)，本書(shū)對(duì)多層 LCP 電路板中過(guò)孔互連結(jié)構(gòu)的建模進(jìn)行了深入的討論，為毫米波寬帶電路設(shè)計(jì)提供了借鑒。為了克服多層 LCP 電路板中過(guò)孔不易實(shí)現(xiàn)的難題，本書(shū)對(duì)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)進(jìn)行了系統(tǒng)研究，并且基于多模耦合理論，設(shè)計(jì)了毫米波頻段的超寬帶過(guò)渡結(jié)構(gòu)。LCP 無(wú)源器件的設(shè)計(jì)為 LCP 電路系統(tǒng)一體化集成提供了優(yōu)異的解決方案。本書(shū)可作為微波、毫米波電路設(shè)計(jì)人員的參考資料。
劉維紅，副教授，男，1980年4月出生，中共黨員，電子科學(xué)與技術(shù)專(zhuān)業(yè)博士，西安郵電大學(xué)電子信息專(zhuān)業(yè)碩士生導(dǎo)師�，F(xiàn)主要從事射頻/微波/毫米波有源無(wú)源器件以及集成電路系統(tǒng)的設(shè)計(jì)與研究。1999年9月至2003年7月就讀于陜西理工大學(xué)物理系,獲理學(xué)學(xué)士學(xué)位。2003年9月到2004年7月在華縣咸林中學(xué)從事高中物理教學(xué)。2004年9月至2007年7月，在西北大學(xué)物理系凝聚態(tài)物理專(zhuān)業(yè)，獲得碩士學(xué)位。2007年9月到2011年3月，在西安交通大學(xué)電子陶瓷與器件教育部重點(diǎn)實(shí)驗(yàn)室攻讀博士學(xué)位。2019年1月到2019年12月在新加坡國(guó)立大學(xué)做訪問(wèn)學(xué)者12個(gè)月。2011年4月至今，在西安郵電大學(xué)電子工程學(xué)院微電子學(xué)系主要承擔(dān)模擬集成電路設(shè)計(jì)、電子技術(shù)基礎(chǔ)(模擬部分)的教學(xué)工作。主持參與國(guó)家以及省部級(jí)項(xiàng)目多項(xiàng)，擔(dān)任電子元器件關(guān)鍵材料與技術(shù)專(zhuān)委會(huì)委員。獲得陜西科學(xué)技術(shù)獎(jiǎng)二等獎(jiǎng)一次，陜西高等學(xué)�？茖W(xué)技術(shù)獎(jiǎng)二等獎(jiǎng)一次，西安市科學(xué)技術(shù)一等獎(jiǎng)一次。獲得專(zhuān)利2項(xiàng)，發(fā)表論文二十多篇，其中被SCI、EI索引十多篇。
第 1 章 LCP 材料簡(jiǎn)介及制備工藝 ··············································································1
1.1 LCP 材料的發(fā)展歷史 ···················································································.1
1.2 LCP 材料的基本特性 ···················································································.4
1.3 LCP 材料的應(yīng)用 ·························································································.6
1.4 單層 LCP 基板制備工藝 ·············································································.10
1.5 多層 LCP 基板制備工藝 ·············································································.13
1.6 多層 LCP 基板關(guān)鍵工藝技術(shù) ·······································································.17
1.7 本章總結(jié) ································································································.22
1.8 參考文獻(xiàn) ································································································.22
第 2 章 多層 LCP 電路板中過(guò)孔互連結(jié)構(gòu)的研究 ························································24.
2.1 多層 LCP 電路板建模方法的研究 ·································································.24
2.1.1 多層 LCP 電路板建模方法的研究與發(fā)展現(xiàn)狀 ··············································.24
2.1.2 帶有過(guò)孔的多層 LCP 電路板建模流程 ·······················································.28
2.2 CPWG-SL-CPWG 過(guò)孔互連結(jié)構(gòu)的設(shè)計(jì)與實(shí)現(xiàn) ················································.30
2.2.1 過(guò)孔互連結(jié)構(gòu)的基本模型 ······································································.31
2.2.2 過(guò)孔互連結(jié)構(gòu)的仿真設(shè)計(jì) ······································································.33
2.2.3 過(guò)孔互連結(jié)構(gòu)的匹配優(yōu)化 ······································································.36
2.2.4 過(guò)孔互連結(jié)構(gòu)的表征與測(cè)試 ···································································.41
2.3 CPWG-SL-CPWG 過(guò)孔互連結(jié)構(gòu)的快速收斂等效電路模型 ·································.42
2.3.1 典型的П型等效電路模型 ······································································.43
2.3.2 П型等效電路模型寄生參數(shù)提取 ······························································.44
2.3.3 過(guò)孔互連結(jié)構(gòu)的快速收斂等效電路模型的構(gòu)建 ············································.49
2.3.4 等效電路模型的仿真驗(yàn)證 ······································································.51
2.4 CPWG-SL-CPWG 過(guò)孔互連結(jié)構(gòu)的高精度等效電路模型 ····································.53
2.4.1 電源／接地面對(duì)過(guò)孔傳輸特性的影響 ························································.54
2.4.2 典型過(guò)孔的內(nèi)在等效電路模型·································································.57
2.4.3 內(nèi)在等效電路模型的參數(shù)提取·································································.59
2.4.4 過(guò)孔互連結(jié)構(gòu)的高精度等效電路模型的構(gòu)建 ···············································.61
2.4.5 等效電路模型的仿真驗(yàn)證 ······································································.62
2.5 本章總結(jié) ································································································.65
2.6 參考文獻(xiàn) ································································································.66
第 3 章 毫米波射頻前端系統(tǒng)中鍵合線(xiàn)電路的分析與設(shè)計(jì) ·············································.70
3.1 鍵合線(xiàn)材料的分析 ····················································································.71
3.2 引線(xiàn)鍵合技術(shù)的簡(jiǎn)介 ·················································································.72
3.3 鍵合線(xiàn)等效電路模型的構(gòu)建 ········································································.74
3.3.1 鍵合線(xiàn)幾何長(zhǎng)度的提取 ·········································································.74
3.3.2 鍵合線(xiàn)寄生參數(shù)的提取 ·········································································.77
3.3.3 雙線(xiàn)鍵合的等效電路模型 ······································································.79
3.3.4 鍵合線(xiàn)結(jié)構(gòu)參數(shù)對(duì)其傳輸特性的影響 ························································.80
3.4 Ka 波段鍵合線(xiàn)匹配電路的設(shè)計(jì)與實(shí)現(xiàn) ··························································.87
3.4.1 基于微帶線(xiàn)的單線(xiàn)鍵合匹配電路 ······························································.87
3.4.2 基于微帶線(xiàn)的雙線(xiàn)鍵合匹配電路 ······························································.94
3.5 W 波段鍵合線(xiàn)匹配電路的設(shè)計(jì)與實(shí)現(xiàn) ···························································.99
3.5.1 基于 CPWG 的雙線(xiàn)鍵合匹配電路 ···························································.100
3.5.2 基于 CPWG 的單線(xiàn)鍵合匹配電路 ···························································.107
3.6 基于 LCP 基板的鍵合線(xiàn)匹配電路的設(shè)計(jì)流程 ·················································.112
3.7 本章總結(jié) ·······························································································.113
3.8 參考文獻(xiàn) ·······························································································.114
第 4 章 微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu) ································································.116
4.1 微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的基本特性 ················································.116
4.1.1 微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的提出 ··················································.116
4.1.2 微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)多模諧振器的基本結(jié)構(gòu) ···············································.117
4.1.3 微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)多模諧振器的工作原理 ···············································.117
4.1.4 微帶線(xiàn)-微帶線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)等效電路模型分析 ···································.118
4.2 T 型枝節(jié)線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu) ····································································.120
4.2.1 T 型枝節(jié)線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)等效電路分析 ··············································.120
4.2.2 均勻雙槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的設(shè)計(jì) ·····························································.122
4.2.3 T 型枝節(jié)線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的設(shè)計(jì) ·······················································.128
4.2.4 T 型枝節(jié)線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的制作工藝 ·················································.132
4.2.5 T 型枝節(jié)線(xiàn)槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的表征與測(cè)試 ··············································.133
4.3 微帶枝節(jié)加載槽線(xiàn)耦合過(guò)渡結(jié)構(gòu) ·································································.135
4.3.1 微帶枝節(jié)加載槽線(xiàn)諧振器的提出 ·····························································.135
4.3.2 微帶枝節(jié)加載槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的設(shè)計(jì) ····················································.136
4.3.3 微帶枝節(jié)加載槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的表征與測(cè)試 ···········································.146
4.4 環(huán)形諧振器槽線(xiàn)耦合過(guò)渡結(jié)構(gòu) ····································································.149
4.4.1 環(huán)形諧振器均勻雙槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的設(shè)計(jì) ··············································.149
4.4.2 環(huán)形諧振器背對(duì)背 Y 型槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的設(shè)計(jì) ·······································.150
4.4.3 環(huán)形諧振器 H 型槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的設(shè)計(jì) ················································.153
4.4.4 環(huán)形諧振器槽線(xiàn)耦合過(guò)渡結(jié)構(gòu)的表征與測(cè)試 ··············································.155
4.5 本章總結(jié) ·······························································································.158
4.6 參考文獻(xiàn) ·······························································································.159
第 5 章 基于 LCP 無(wú)源器件的設(shè)計(jì)與研究 ·······························································.161
5.1 LCP 無(wú)源電感的概述 ················································································.161
5.2 LCP 集總參數(shù)電感性能的研究 ····································································.164
5.2.1 水平螺旋電感性能的研究 ·····································································.164
5.2.2 平面螺旋電感性能的研究 ·····································································.169
5.2.3 8-shaped 型電感性能的研究 ···································································.175
5.3 LCP 分布式電感性能的研究 ·······································································.178
5.4 垂直叉指電容的概述 ················································································.180
5.5 垂直叉指電容性能的研究 ··········································································.181
5.5.1 電容 型等效電路模型的分析 ·································································.181
5.5.2 二端口電容結(jié)構(gòu)參數(shù)的分析 ··································································.183
5.5.3 單端口電容結(jié)構(gòu)參數(shù)的分析 ··································································.187
5.6 垂直叉指電容的優(yōu)化設(shè)計(jì) ··········································································.189
5.6.1 帶有 DGS 的二端口正方形垂直叉指電容 ··················································.190
5.6.2 帶有 DGS 的單端口正方形垂直叉指電容 ··················································.191
5.7 UHF 濾波器設(shè)計(jì)的概述 ············································································.195
5.8 UHF 集總參數(shù)低通濾波器的設(shè)計(jì) ································································.197
5.8.1 低通濾波器電路與參數(shù)的分析································································.197
5.8.2 低通濾波器的仿真設(shè)計(jì) ········································································.198
5.8.3 低通濾波器的實(shí)物測(cè)試 ········································································.200
5.9 UHF 集總參數(shù)帶通濾波器的設(shè)計(jì) ································································.202
5.9.1 帶通濾波器的仿真設(shè)計(jì) ········································································.202
5.9.2 帶通濾波器的實(shí)物測(cè)試 ········································································.205
5.10 UHF 半集總參數(shù)雙通帶通濾波器的設(shè)計(jì) ·····················································.207
5.10.1 半集總濾波器電路與參數(shù)分析 ······························································.207
5.10.2 半集總濾波器的仿真設(shè)計(jì) ····································································.210
5.10.3 半集總濾波器的實(shí)物測(cè)試 ····································································.212
5.11 本章總結(jié) ·····························································································.214
5.12 參考文獻(xiàn) ·····························································································.215
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